SEMICAT PROVIDES FOUNDRY SERVICE FOR SINGLE AND MULTIPLE LAYER DEPOSITION TO HELP WITH CUSTOMER’S CAPACITY CONSTRAINTS. OUR DEDICATED TOOL CAN BE CONFIGURED TO THE CUSTOMER’S DEMAND TO MEET THEIR DESIRED NEEDS. THE ENTIRE TOOL OR SINGLE CHAMBERS CAN BE RESERVED UPON REQUEST. SEMICAT CAN OFFER FLEXIBLE SCHEDULING FOR THE TOOL AND THERE IS NO MINIMUM LOT REQUIREMENT.
Wafer Size
Size : 100mm, 150mm, 200mm, 300mm
Shape: Notch, Flat, Double Flat, Rectangular, Thin Wfr
Material: Si, GaAs, Glass, Sapphire, Sic
Process Films
Metal (AI, TI, TIN, NIV, Ag, Cr, Ni, Cu, etc.)
Oxides/Nitrides (Al2O3, AIN, SiO2, SiN, TiOx)
Novel Films (TiW, TIWN, W, WN, Nb, Ge, Si, SiCr, ITO)
Technology
Standard PVD // IMP // SIP // SIP EnCoRe
STD DC // DC Pulse // RF
Clamped // B101 // ESC